NTTFS5826NL
Power MOSFET
60 V, 24 m W , Single N ? Channel, m 8FL
Features
? Small Footprint (3.3 x 3.3 mm) for Compact Designs
? Low Q G(TOT) to Minimize Switching Losses
? Low Capacitance to Minimize Driver Losses
? These are Pb ? Free Devices
http://onsemi.com
Applications
? Motor Drivers
? DC ? DC Converters
? Synchronous Rectification
? Power Management
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
V (BR)DSS
60 V
R DS(on) MAX
24 m W @ 10 V
32 m W @ 4.5 V
N ? Channel
D
I D MAX
20 A
Parameter
Drain ? to ? Source Voltage
Symbol
V DSS
Value
60
Unit
V
Gate ? to ? Source Voltage
V GS
" 20
V
G
Continuous Drain
Current R Y J ? mb
(Notes 1, 2, and 3)
T mb = 25 ° C
T mb = 100 ° C
I D
20
14
A
S
T A = 25 ° C
Power Dissipation
R Y J ? mb (Notes 1, 2,
and 3)
Continuous Drain
Current R q JA (Notes 1
& 3)
Power Dissipation
R q JA (Notes 1 & 3)
Pulsed Drain Current
T mb = 25 ° C
Steady T mb = 100 ° C
State
T A = 100 ° C
T A = 25 ° C
T A = 100 ° C
T A = 25 ° C, t p = 10 m s
P D
I D
P D
I DM
19
10
8
6
3.1
1.6
133
W
A
W
A
1
WDFN8
( m 8FL)
CASE 511AB
5826
A
MARKING DIAGRAM
1
S D
S 5826 D
S AYWW G D
G G D
= Specific Device Code
= Assembly Location
Operating Junction and Storage Temperature
Source Current (Body Diode)
Single Pulse Drain ? to ? Source Avalanche
Energy (T J = 25 ° C, V DD = 50 V, V GS = 10 V,
I L(pk) = 14.4 A, L = 1.0 mH, R G = 25 W )
Lead Temperature for Soldering Purposes
(1/8 ″ from case for 10 s)
T J , T stg
I S
E AS
T L
? 55 to
175
20
20
260
° C
A
mJ
° C
Y = Year
WW = Work Week
G = Pb ? Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device Package Shipping ?
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter Symbol Value Unit
Junction ? to ? Mounting Board (top) ? Steady R Y J ? mb 7.9 ° C/W
State (Notes 2, 3)
NTTFS5826NLTAG WDFN8 1500/Tape & Reel
(Pb ? Free)
NTTFS5826NLTWG WDFN8 5000/Tape & Reel
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Junction ? to ? Ambient ? Steady State (Note 3)
R q JA
48
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Psi ( Y ) is used as required per JESD51 ? 12 for packages in which
substantially less than 100% of the heat flows to single case surface.
3. Surface ? mounted on FR4 board using a 650 mm 2 , 2 oz. Cu pad.
? Semiconductor Components Industries, LLC, 2011
November, 2011 ? Rev. 2
1
Publication Order Number:
NTTFS5826NL/D
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